I. Aerospace and Military Field

1. High-temperature structural components

Key components of rocket engines: nozzle throat liners, gas vanes, nose cones, etc. Utilizing the high melting point of tungsten (3410) and the evaporative cooling effect of copper (copper absorbs heat when heated at high temperatures), they can resist the erosion and scouring of over 3000-mph gas streams, ensuring the stable operation of the engine under extreme conditions.

Thermal protection for missiles and spacecraft: high-temperature components of satellite attitude control engines, leading-edge thermal barrier materials for hypersonic aircraft. By adjusting the tungsten-copper ratio (such as high tungsten content WCu80), they can balance high-temperature strength and thermal shock resistance.

2. Kinetic weapons and armor-piercing ammunition

Electromagnetic gun track materials: high-density tungsten-copper alloys (such as WCu70) as track conductors, capable of withstanding high current impacts and friction from high-speed projectiles, and having both conductivity and wear resistance.

Armor-piercing ammunition cover: Utilizing high density (17-18 g/cm³) and high melting point properties, it forms a high-temperature jet during the armor-piercing process, enhancing the penetration capability against armor.

II. Electronics and Semiconductor Industry

1. Heat dissipation and packaging for high-power devices

Heat sinks and packaging substrates: 5G base station power amplifier modules, IGBT power modules, laser diodes' heat dissipation bases, using materials with medium to low tungsten content (such as WCu50-WCu60), matching the thermal expansion coefficient (CTE 5-8×10⁻⁶/°C) of silicon (Si)/gallium arsenide (GaAs) chips, avoiding thermal stress-induced solder joint failure, and quickly discharging the heat generated by high-frequency devices (thermal conductivity 150-220 W/m·K).

Microwave and RF components: radar T/R components, substrate materials for power amplifiers, utilizing low dielectric loss and high signal transmission stability to meet the signal integrity requirements of 5G/6G high-frequency bands (>28 GHz).

2. Key components of power systems

High-voltage switch contacts: arc contacts for 110kV and above circuit breakers, relays, the tungsten-copper (such as WCu70) arc contacts have a significantly lower arc erosion rate (loss rate < 0.1% at arc temperatures of 3000-5000) compared to pure copper, reducing contact wear and extending equipment lifespan.

Spark plug and discharge tube electrodes: in overvoltage protection devices, they withstand instantaneous high current impacts, avoiding electrode welding or burn-through.

III. Industrial Manufacturing and Precision Processing

1. Electrochemical machining (EDM) electrodes

Hard alloy mold processing: for difficult-to-machine materials such as tungsten carbide (WC) and high-speed steel, tungsten-copper electrodes (such as WCu50) have an electrode corrosion loss rate (about 0.5-1%) that is only 1/3 of that of pure copper, and have a processing accuracy of ±0.001mm, suitable for the formation of precision gears and optical lens molds.

Micro-processing field: in nanometer-level electrochemical machining, using the high hardness (HV 220-280) and low loss characteristics of tungsten-copper (such as WCu60-WCu70), to make microelectrodes (diameter ≤ 0.1mm), processing MEMS devices, microfluidic chips, etc., complex structures.

2. Resistance welding and laser welding electrodes

Convex welding / butt welding electrodes: in automotive component welding (such as battery pack copper bars, motor stators), tungsten-copper electrodes (WCu60-WCu70) are resistant to high temperatures (above 500°C), anti-copper alloy adhesion, reducing welding defects, and improving the efficiency of automated welding.

Laser welding reflectors: high-conductivity tungsten-copper substrates used to support laser welding heads, quickly dissipating local high heat and avoiding thermal deformation of the optical path system.

IV. Medical and Nuclear Industry

1. Radiation shielding and protection

Medical radioactive equipment: shielding blocks for γ-ray radiotherapy equipment, inner linings of nuclear medicine drug filling glove boxes, using high-density tungsten-copper (such as WCu85, density 17g/cm³) to block radioactive substance leakage, protecting the safety of medical staff. Nuclear reactor components: Control rod ends, neutron shielding materials, featuring both high-temperature radiation resistance and corrosion resistance.

2. Core components of medical equipment

CT machine rotating anode target material: The anode target surface of the X-ray tube adopts a tungsten-copper composite structure. The tungsten layer (with high atomic number) generates X-rays, while the copper layer quickly conducts heat (thermal conductivity ≥ 180 W/m·K), preventing the anode from overheating and damaging, ensuring the stability and imaging accuracy of CT scans.

V. Other special fields

1. Precision instruments and counterweights

Inertial navigation system counterweight blocks: Counterweight components for high-precision gyroscopes and accelerometers, utilizing high density (16-18 g/cm³) and dimensional stability to ensure equipment balance accuracy.

Aircraft engine dynamic balance ring: Counterweight material for high-speed rotating components, preventing fatigue failure due to vibration.

2. New energy and green technology

Fuel cell bipolar plates: In high-temperature proton exchange membrane fuel cells (HT-PEMFC), the tungsten-copper coating enhances the conductivity and corrosion resistance of graphite plates, extending battery life.

Photovoltaic industry: High-temperature guide plates for polycrystalline silicon ingot furnaces, capable of withstanding radiation heat of 1500°C or above, ensuring uniform crystal growth.

VI. Selection basis and application optimization

High temperature strength priority (e.g. > 1500): Select high tungsten content (WCu70-WCu85), such as rocket throat linings, electrical spark electrodes.

Thermal conductivity and compatibility priority (e.g. electronic packaging): Medium to low tungsten content (WCu30-WCu60), balancing thermal expansion coefficient (CTE) and thermal conductivity efficiency.